15 “Precision Automatic Lapping / Polishing Machine with One Slurry Feeder and Three 4” Workstations – EQ-Unipol-1502
EQ-UNIPOL-1502 The machine is equipped with a 14 -15 “diameter super flat lapping plate and can be used as a high precision lapping machine for polishing crystal parts, semiconductor wafers and ceramic surfaces up to three workstations up to 4” diameter. In addition, a standard grinding and polishing machine can be adopted to prepare metallographic samples.