Precision CNC Dicing / Dicing Saw with Digital Control and Complete Accessories – SYJ-800

SYJ-800 is a CE certified slicing saw designed to cut and cut almost any material up to 8 “diameter wafer or 8” L x 8 “W x 1” H components. SYJ-800 tester,X, YZ in three sizes Programmable by computer with 0.01 mm position accuracy and sample stage ,by an electric motor to cut with a tolerance of +/- 0.5 ° at any angle rotatable . Al2O3 ceramic plate for electronic surfaces and solar energy panels and Si or Ge wafer is the perfect tool for dicing.